By Louis Scheffer, Luciano Lavagno, Grant Martin
ISBN-10: 0849379237
ISBN-13: 9780849379239
Proposing a entire review of the layout automation algorithms, instruments, and methodologies used to layout built-in circuits, the Electronic layout Automation for built-in Circuits Handbook comes in volumes. the 1st quantity, EDA for IC approach layout, Verification, and Testing, completely examines system-level layout, microarchitectural layout, logical verification, and checking out. Chapters contributed via top specialists authoritatively talk about processor modeling and layout instruments, utilizing functionality metrics to choose microprocessor cores for IC designs, layout and verification languages, electronic simulation, acceleration and emulation, and lots more and plenty extra. store at the entire set.
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Additional info for EDA for IC System Design, Verification, and Testing (Electronic Design Automation for Integrated Circuits Hdbk)
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26x and MPEG efforts. Modern video compression systems combine lossy and lossless encoding methods to reduce the size of a video stream. Lossy methods throw away information as a result of which the uncompressed video stream is not a perfect reconstruction of the original; lossless methods do allow the information provided to them to be perfectly reconstructed. Most modern standards use three major mechanisms: ● ● ● The discrete cosine transform (DCT) together with quantization Motion estimation and compensation Huffman-style encoding The first two are lossy while the third is lossless.
Here, a test tool adds extra logic on top of the DFT to generate scan vectors dynamically. Before continuing the layout, the engineer needs new sets of rules, dealing with the legal placement and routing of the netlist. , LEF for logic, DEF for design and PDEF for physical design, provide the layout engineer physical directions and constraints. Unlike the technology rules for synthesis, these rules are typically model-dependent. For example, there may be information supplied by the circuit designer about the placement of macros such as memories.
One of the major obstacles to routing is signal congestion. Congestion occurs when there are too many wires competing for a limited amount of chip wire resource. Remember that the design team gave the design planner a utilization ratio in the hope of avoiding this problem. Both global routing and detailed routing take the multilayers of the chip into consideration. For example, the router assumes that the gates are on the polysilicon layer, while the wires connect the gates through vias on 3–8 layers of metal.