By Baker Mohammad
ISBN-10: 146148880X
ISBN-13: 9781461488804
This publication describes a few of the tradeoffs structures designers face while designing embedded reminiscence. Readers designing multi-core structures and structures on chip will enjoy the dialogue of other themes from reminiscence structure, array association, circuit layout ideas and layout for try out. The presentation allows a multi-disciplinary method of chip layout, which bridges the distance among the structure point and circuit point, so one can handle yield, reliability and power-related concerns for embedded reminiscence.
Read or Download Embedded Memory Design for Multi-Core and Systems on Chip PDF
Similar microprocessors & system design books
Learn Hardware, Firmware and Software Design
This ebook is a pragmatic layout undertaking and it includes three components: 1. layout publications the reader in the direction of development the LHFSD PCB with a Microchip dsPIC30F4011 microcontroller operating at 80MHz. a variety of modules are outfitted, separately, and they're completely defined. 2. Firmware layout makes use of the Microchip C30 compiler.
Digital Desing and Computer Architecture
Electronic layout and desktop structure is designed for classes that mix electronic good judgment layout with desktop organization/architecture or that train those matters as a two-course series. electronic layout and laptop structure starts off with a contemporary technique through carefully masking the basics of electronic common sense layout after which introducing Description Languages (HDLs).
Assembly Language Programming : ARM Cortex-M3
ARM designs the cores of microcontrollers which equip such a lot "embedded platforms" in response to 32-bit processors. Cortex M3 is this kind of designs, lately constructed by way of ARM with microcontroller purposes in brain. To conceive a very optimized piece of software program (as is usually the case on this planet of embedded structures) it is usually essential to know the way to software in an meeting language.
This yr, for the 8th time, the eu convention on Object-Oriented Programming (ECOOP) sequence, in cooperation with Springer, is comfortable to o? er the object-oriented examine group the ECOOP 2004 Workshop Reader, a compendium of workshop studies bearing on the ECOOP 2004 convention, held in Oslo from June 15 to 19, 2004.
- The Microcontroller Idea Book: Circuits, Programs and Applications Featuring the 8052-Basic Single-Chip Computer
- High Performance Embedded Computing Handbook: A Systems Perspective
- Digital Signal Processing with Field Programmable Gate Arrays
- Heterogeneous Multicore Processor Technologies for Embedded Systems
- Real-time Embedded Systems: Optimization, Synthesis, and Networking
Additional resources for Embedded Memory Design for Multi-Core and Systems on Chip
Example text
In addition to these factors, controlling variability through process technology further reduces the device parameter shift. The SRAM cell stability and its effect on both yield and power have been addressed through several techniques, and they are as follows: 1. 2. 3. 4. 5. Process technology and transistor sizing SRAM cell modification Voltage islands Body/well biasing Circuit techniques, often referred, to as assist circuits Each of the above techniques targets one or more factors to reduce the impact of cell stability on the overall power and yield.
On the other hand, a singleissue general-purpose processor will have less activity on the PA bus, which makes the CAM-based tag more power-efficient. 5 Summary Tag Selection Deciding on the tag array used in the memory subsystem has significant implications on power, area, and speed. In our analysis, we showed that CAM-based tags always are larger in area (constituting about 10–20 % of the total cache). Since memory subsystems constitute more than 50 % of the area in modern processors, this characteristic makes the CAM-based tag area overhead to the total processor area between 5 and 10 %.
Fig. 2 Memory hierarchy for multi-core [18] 32 3 Embedded Memory Hierarchy Fig. 3 Die photo of high-end z-processor showing memory hierarchy [18] As for cost different technology provides tradeoffs, for example eDRAM added masks to normal CMOS to realize trench capacitance. The additional cost associated with the eDRAM masks has to be offsetted by the area saving from using eDRAM versus SRAM. The memory size has to be big enough to make up for cost and it is estimated to be greater than 4 MB at 45 nm technology.