By Rajiv Kohli, Kashmiri L. Mittal
Developments in floor illness and cleansing: tools for floor cleansing, quantity 9, a part of the Developments in floor illness and Cleaning sequence offer a cutting-edge consultant to the present wisdom at the habit of film-type and particulate floor contaminants and their linked cleansing equipment.
This most up-to-date quantity within the sequence discusses tools of floor cleansing of contaminants and the assets which are had to take care of them. Taken as a complete, the sequence types a different reference for pros and lecturers operating within the sector of floor infection and cleansing. a powerful subject working during the sequence is that of floor illness and cleansing on the micro and nano scales.
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Additional resources for Developments in Surface Contamination and Cleaning, Volume 9: Methods for Surface Cleaning
There will be more research challenges and business opportunities in the area of damage-free nonaqueous and dry cleaning technologies for nanostructures, especially since leading-edge devices will become more complex, more fragile, and more damage sensitive in the near future. REFERENCES 1. B. K. Kirkpatrick, J. J. Chambers, S. L. Prins, D. J. Riley, W. Z. Xiong, and X. Wang, “Material Loss Impact on Device Performance for 32 nm CMOS and Beyond”, Solid State Phenom. 145-146, 245 (2009). 2. T. Hattori, “Key Issues in Wet Chemical Cleaning of Silicon Surfaces,” in: Cleaning Technology in Semiconductor Device Manufacturing V, J.
Kim, G. Zhang, F. Escbach, and A. Ramamoorthy, “Nanoscsale Particles Removal on an Extreme Ultra-Violet Lithography (EUVL) Mask Layer by Laser Shock Cleaning”, ECS Trans. 1, 26 (2005). 5 9. K. Wostyn, T. G. Kim, P. W. Mertens, and J. G. Park, “Analyzing the Collapse Force of Narrow Lines Measured by Lateral Force AFM Using an Analytical Mechanical Model”, Solid State Phenom. 145-146, 55 (2009). 4 Nuclear Materials Decontamination 56 9 Summary 59 Acknowledgements 60 Disclaimer 60 References 60 1 INTRODUCTION Wet and dry cleaning are well-established processes for removal of surface contaminants in a variety of industrial applications.
Sun, N. Bekiaris, and R. Visser, “Supercritical Drying: A Sustainable Solution to Pattern Collapse of High-Aspect-Ratio and Low-Mechanical-Strength Device Structures”, ECS Trans. 69, 119 (2015). T. Tanaka, M. Morigami, and N. Atoda, “Mechanism of Resist Pattern Collapse During Development Process”, Jpn. J. Appl. Phys. 32, 6059 (1993). H. B. Cao, P. F. -D. Domke, “Comparison of Resist Collapse Properties for Deep Ultraviolet and 193 nm Resist Platforms”, J. Vac. Sci. Technol. B 18, 3303 (2000). D.