By Yoshihiko Imanaka
ISBN-10: 0387231307
ISBN-13: 9780387231303
ISBN-10: 0387233148
ISBN-13: 9780387233147
In recent times, Low Temperature Cofired Ceramics (LTCC) became an enticing expertise for digital elements and substrates which are compact, gentle, and provide high-speed and performance for transportable digital units reminiscent of mobile telephones, own electronic assistants (PDA) and private pcs used for instant voice and knowledge communique in swiftly increasing cellular community platforms. LTCC are in particular appropriate for the excessive frequency circuits required for high-speed info communications.
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Extra info for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
Example text
Mandai, K. Sugoh, K. Tsukamoto, H. Tani, M. Murata, “A Low Temperature Cofired Multilayer Ceramic Substrate Containing Copper Conductors”, IMC 1986 Proceedings, May, (1986), pp. 61-64. [28] K. Niwa, N. Kamehara, K. Yokouchi, and Y. Imanaka, “Multilayer Ceramic Circuit Board with a Copper Conductor”, Advanced Ceramic Materials, Vol. 2, No. 4, Oct. (1987) pp. 832-835. [29] S. Tosaka, S. Hirooka, N. Nishimura, K. Hoshi, and N. Yamaoka, “Properties of a low temperature fired multilayer ceramic substrate”, ISHM Proc.
As it is comparatively easy to combine Low Temperature Cofired Ceramics (LTCC) with materials that have different characteristics, it is possible to integrate and build the different types of components into the ceramic. Furthermore, while it is possible to incorporate low loss metal into LTCCs as a conductor, ceramic has low dielectric loss at high frequencies making it effective for achieving low loss performance, compared with other materials such as resin and the like. In addition, its thermal expansion coefficient compared with resin materials and other ceramic materials is low, and it has the merit of excellent connection reliability for high density packaging of LSI components.
For these reasons, LTCCs are regarded as a 2 Multilayered LTCC Technology promising future technology for the integration of components and substrates for high frequency applications. 1 Brief historical review The origin of multilayer ceramic substrate technology is said to lie in developments at RCA Corporation in the late 1950s, and the bases of current process technologies (green sheet fabrication technology, via forming technology, and multilayer laminate technology using the doctor blade method) were discovered at this time [6-8].