By Ning-Cheng Lee
Desirous about technological thoughts within the box of electronics packaging and construction, this e-book elucidates the alterations in reflow soldering strategies, its impression on disorder mechanisms, and, for this reason, the troubleshooting strategies in the course of those procedures in various board kinds. aimed toward electronics production procedure engineers, layout engineers, in addition to scholars in method engineering sessions, Reflow Soldering strategies and Troubleshooting can be a powerful contender within the carrying on with ability improvement marketplace for production personnel.
Written utilizing a truly functional, hands-on technique, Reflow Soldering tactics and Troubleshooting presents the capacity for engineers to extend their knowing of the rules of soldering, flux, and solder paste know-how. the writer allows studying approximately different crucial subject matters, comparable to region array packages--including BGA, CSP, and FC designs, bumping approach, meeting, and remodel process,--and offers an elevated knowing of the reliability failure modes of soldered SMT elements. With rate effectiveness premiere in brain, this publication is designed to troubleshoot blunders or difficulties ahead of forums pass into the producing procedure, saving money and time at the entrance finish. The author's immense services and data make sure that assurance of subject matters is expertly researched, written, and arranged to top meet the desires of producing strategy engineers, scholars, practitioners, and somebody with a wish to study extra approximately reflow soldering approaches. finished and essential, this publication will end up an ideal education and reference device that readers will locate invaluable.
Provides engineers the state-of-the-art know-how in a swiftly altering field
Offers in-depth assurance of the rules of soldering, flux, solder paste know-how, sector array packages--including BGA, CSP, and FC designs, bumping approach, meeting, and the transform technique
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Extra resources for Reflow Soldering Processes
H. J. Fisher and A. Pillips, ‘‘Viscosity and Density of Liquid Lead–tin and Antimony–cadmium Alloys’’, J. Inst. , Vol. 11, pp. 1060–1070 (1954). 29. J. C. Ambrose, M. G. Nicholas, and A. M. Stoneham, ‘‘Kinetics of Brazing Spreading’’, Proc. Conf. British Association for Brazing and Soldering, 1992 Autumn Conference, Coventry, UK. 30. J. Glazer, ‘‘Metallurgy of Low Temperature Pb-free Solders for Electronic Assembly’’, International Materials Reviews, Vol. 40, No. 2, pp. 65–93 (1995). 31. D. Grivas, MS Thesis, University of California at Berkeley, January, 1974.
It is helpful in providing the composition of probable phases as well as the melting temperature of those components. Being thermodynamic in nature, a phase diagram cannot predict kinetic properties, such as reaction rate between ingredients, and wetting characteristics, such as wetting speed on an oxidized base metal. In addition, it cannot predict the morphology of various phases in the solder joint. Although soldering is typically a short process involving chemical reactions, hence being highly kinetic in nature, proper use of a phase diagram together with supplementary information does allow a deeper understanding and some prediction of soldering behavior.
This process is aggravated by (1) increase in grain size, which enhances the stress concentration at grain junctions, (2) irregular grain shapes, which introduce sites of unusual stress concentration, and (3) possibly intergranular precipitates, which constrain deformation at grain boundaries, which can result in uneven stress distribution. Plastic instability occurs mainly at shear bands which often follow planes of microstructural weakness, such as phase boundaries and colony boundaries in eutectic materials [35,36].