By Ning-Cheng Lee PhD
ISBN-10: 008049224X
ISBN-13: 9780080492247
Keen on technological suggestions within the box of electronics packaging and construction, this publication elucidates the adjustments in reflow soldering techniques, its influence on illness mechanisms, and, for this reason, the troubleshooting strategies in the course of those strategies in various board forms. aimed toward electronics production procedure engineers, layout engineers, in addition to scholars in method engineering sessions, Reflow Soldering approaches and Troubleshooting can be a robust contender within the carrying on with ability improvement marketplace for production personnel.
Written utilizing a really useful, hands-on process, Reflow Soldering procedures and Troubleshooting offers the potential for engineers to extend their knowing of the rules of soldering, flux, and solder paste know-how. the writer enables studying approximately different crucial themes, equivalent to zone array packages--including BGA, CSP, and FC designs, bumping procedure, meeting, and transform process,--and presents an elevated knowing of the reliability failure modes of soldered SMT parts. With expense effectiveness most excellent in brain, this booklet is designed to troubleshoot mistakes or difficulties prior to forums move into the producing technique, saving time and cash at the entrance finish. The author's titanic services and data make sure that insurance of themes is expertly researched, written, and arranged to top meet the desires of producing strategy engineers, scholars, practitioners, and somebody with a wish to examine extra approximately reflow soldering strategies. complete and vital, this e-book will turn out an ideal education and reference instrument that readers will locate invaluable.
Provides engineers the state-of-the-art expertise in a speedily altering field
Offers in-depth assurance of the foundations of soldering, flux, solder paste know-how, quarter array packages--including BGA, CSP, and FC designs, bumping process, meeting, and the remodel technique
Read Online or Download Reflow soldering processes : SMT, BGA, CSP and flip chip technologies PDF
Similar industrial technology books
Computational electrodynamics: Finite Difference Time Domain Method
Written by way of the pioneer and most suitable authority at the topic, this new booklet is either a entire college textbook and professional/research reference at the finite-difference time-domain (FD-TD) computational answer process for Maxwell's equations. It provides in-depth discussions of: The progressive Berenger PML soaking up boundary ; FD-TD modelling of nonlinear, dispersive, and achieve optical fabrics utilized in lasers and optical microchips; unstructured FD-TD meshes for modelling of complicated platforms; 2.
Progress in Improving Project Management at the Department of Energy
The dept of strength (DOE) is engaged in several multimillion- or even multibillion-dollar tasks which are extraordinary or first of a sort and require state of the art expertise. The initiatives symbolize the various nature of DOE's missions, which surround strength structures, nuclear guns stewardship, environmental recovery, and uncomplicated examine.
Handbook of metal injection molding
The steel injection molding (MIM)process has received major credibility over the past twenty years and has turn into frequent in industry segments formerly impenetrable, together with scientific implants and aerospace componentry. Many editions of the expertise were constructed and commercialized, leading to over four hundred advertisement MIM corporations world wide.
- Advanced Processing and Manufacturing Technologies for Structural and Multifunctional Materials III (Ceramic Engineering and Science Proceedings)
- Social Responsibility in the Information Age: Issues and Controversies
- Computational electrodynamics: the finite-difference time-domain method
Additional info for Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
Sample text
Intergranular creep has an activation energy close to that for grain boundary diffusion, and leads to a very stable and non-damaging plastic deformation. This creep mechanism leads to superplasticity, in which a material undergoes creep strains of several hundred percent prior to failure, hence providing exceptional creep ductility and excellent fatigue resistance. Furthermore, Mei and Morris [33,34] have reported that cyclic deformation by intergranular creep causes little or no microstructural damage.
S. J. Muckett, M. E. Warwick, and P. E. Davis, Plating and Surface Finishing, p. 44 (January 1986). 14. M. Schaefer, W. Laub, J. M. Sabee, R. A. Fournelle, and P. S. Lee, A Numerical Method for Predicting Intermetallic Layer Thickness Developed During the Formation Of Solder Joints’’, Journal of Electronic Materials, Vol. 25, No. 6, pp. 992–1003 (June 1996). 15. M. E. Warwick and S. J. Muckett, ‘‘Observations on the Growth and Impact of Intermetallic Compounds on Tin-coated Substrates’’, Circuit World , Vol.
Of Nepcon West’92, Vol. 3, pp. 1730–1738 (1992). 25. B. Huang and N. C. Lee, ‘‘Prospects of Lead-free Alternatives for Reflow Soldering’’, in Proc. of IPC Works‘99, S-03-10, Minneapolis, MN, 23–28, October 1999. 2/34 Reflow Soldering Processes and Troubleshooting 26. ‘‘Lead-free Solder Project Final Report’’, NCMS Report 0401RE96 (August 1997). 27. C. Handwerker, ‘‘NCMS Lead Free Solder Project: A National Program’’, NEMI Lead Free Solder Meeting, Chicago, 25, May 1999. 28. H. J. Fisher and A. Pillips, ‘‘Viscosity and Density of Liquid Lead–tin and Antimony–cadmium Alloys’’, J.